China IC design firm Rockchip is facing an open-source licensing dispute after GitHub reportedly froze code repositories linked to its projects, drawing attention across the semiconductor and software ...
The Siemens’ EDA toolset has achieved multiple certifications to support TSMC’s advanced N3A, N3C, N2P, TSMC A16, and A14 ...
IC Manage today announced major advances to GDP-AI, its industry-leading design and IP management system, to further empower teams doing custom design in Cadence Virtuoso. The enhancements span ...
Also announce tool certification for TSMC N3C process and initial collaboration on TSMC’s newest A14 technology SAN JOSE, Calif.--(BUSINESS WIRE)-- Cadence (Nasdaq: CDNS) today announced it is ...
Taiwanese integrated circuit design houses used the 2026 Consumer Electronics Show in the US to seek new partnerships, signaling that success in the next phase of edge artificial intelligence will ...
The AI revolution is driving change in how we design and manufacture everything from data centers to servers and chips. Even what we consider a chip is changing from the integration of analog circuits ...
Semiconductor intellectual property (IP) management, reuse, and change tracking are essential for efficiently creating chip designs based on proven building blocks, reducing your time-to-market, and ...
Today, most of the big names in the semiconductor industry are racing into the era of the 3D IC, strapping heterogeneous dies directly on top of each other to improve performance without increasing ...
Siemens has announced an extension of its long‑running collaboration with Taiwan Semiconductor Manufacturing Company (TSMC), expanding joint efforts to advance artificial intelligence‑powered ...
3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...
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