Dublin, March 11, 2026 (GLOBE NEWSWIRE)-- The "Critical Materials for Power Module Packaging: Market Outlook, Supply Chain Risk & Technology Trends 2026-2036" report has been added to ...

Texas Instruments (TI) Inc. has unveiled six new power modules that deliver benefits in power density, efficiency and thermal performance, while reducing size and electromagnetic interference (EMI).

Texas Instruments (NasdaqGS:TXN) has introduced new isolated power modules that use its proprietary IsoShield packaging ...

In an exclusive interview with TI’s director of power management R&D, we explore the role of advanced packaging in low-voltage power electronics. From state-of-the-art materials and process technology ...

Integrated power modules improve density and efficiency for data centres and EVs, while raising design considerations around ...

Founded in 1987, Boschman Technologies B.V. is a manufacturer of sintering equipment and transfer molding technology for advanced packaging of automotive and industrial power modules, MEMS sensors. In ...

Texas Instruments (TI) unveiled at the Applied Power Electronics Conference (APEC) 2026 isolated power modules that allow for ...

Power device manufacturers exhibit their latest advances in topologies, packaging, and solutions at APEC 2026.

BorgWarner (BWA) to present its next-generation double-sided cooled (DSC) 800V SiC power module for high-current-density applications on May 16, 2025, at 9:00 am CET Expert-led virtual presentation ...