Atomic force microscopy (AFM) shows the surface of the TaC thin film before and after annealing at high temperatures. The initial film surface is composed of many columnar grains, whereas after ...

A new development in chip packaging could change how AI processors are built, making them smaller, faster, and more stable in ...

(Nanowerk News) Electronic waste, or e-waste, is a rapidly growing global problem, and it’s expected to worsen with the production of new kinds of flexible electronics for robotics, wearable devices, ...

All of the wondrous gadgets and gizmos that have built the modern technological world come with a major drawback—they eventually end up in the trash. E-waste has been a growing problem for years, and ...

FREUDENSTADT, Germany--(BUSINESS WIRE)--Calumet Electronics (Calumet), a leading American printed circuit board manufacturer, is pioneering the domestic production of advanced packaging substrates.

WICHITA, KS, UNITED STATES, February 15, 2026 /EINPresswire.com/ — Nitride Global, Inc. (NGI), a global leader in ultrawide bandgap Aluminum Nitride materials, and ...

With consumer electronics in a seasonal downturn and no strong market recovery in sight, ABF substrate leader Unimicron expects first-quarter revenue to dip by a single-digit percentage. The company ...

Aurona Industries, a PCB substrate manufacturer, reported a 1.2% revenue growth in May, driven by higher orders from the electronics industry following a temporary US tariff grace period and sustained ...

A new material for flexible electronics could enable multilayered, recyclable electronic devices and help limit e-waste. Electronic waste, or e-waste, is a rapidly growing global problem, and it's ...