Glass substrates are gaining attention as a structural alternative to organic build-up films/cores in advanced semiconductor ...

A new development in chip packaging could change how AI processors are built, making them smaller, faster, and more stable in ...

SCHMID Group (NASDAQ: SHMD), a global leader in advanced manufacturing solutions for the electronics and semiconductor industries, is advancing next-generation substrate manufacturing with its ...

As advanced packaging technologies and large-size integrated substrate solutions become key development areas for technology firms, glass substrate technology has emerged as a focal point, attracting ...

As package sizes grow, warpage can become a real headache. A ceramic approach can offer rigidity where traditional materials ...

Intel disclosed several chip packaging breakthroughs at the Electronic Components Technology Conference (ECTC), outlining the technical merits of multiple new chip packaging techniques. We spoke with ...

As more AI GPU, CPU, and ASIC customers ramp up their market push, advanced packaging capacity continues to face tight supply. This has prompted upstream IC packaging substrate makers to adopt a more ...

New portfolio drives chip performance with panel-based interconnect innovation KLA is extending the capability of the proven Corus™ direct imaging platform and introducing the Serena™ direct imaging ...

Kyocera Corporation (President: Shiro Sakushima; "Kyocera") today announced that it is commercializing a new multilayer ceramic core substrate for advanced semiconductor packages, such as xPUs(1) and ...

Multi-die assemblies offer significant opportunities to boost performance and reduce power, but these complex packages also introduce a number of new challenges, including die-to-RDL misalignment, ...

Packaging is now a performance variable. Substrate, bonding, and process sequence determine what can be built at scale. Warpage underlies most advanced packaging failures and gets harder to control as ...