For the first time, applications that require high-temperature device testing and burn-in, as well as those with high-frequency bandwidth, low inductance and high current conditions, can now ...

The AR4HT Series CSP sockets accept any area-array device for high-temperature testing up to 200°C and incorporate a low-profile 0.45-mm contact structure (compressed) that is shorter than other ...

Electronics are getting smaller and smaller, so it makes sense that testing devices get smaller, too. Electronics are also running more current today, so these systems need to be tested for ...

Peripheral backend supply chain players including makers of high-end customized IC testing sockets, wafer probe cards and burn-in boards, apart from ABF substrates, are all gearing up for robust ...