Samsung Electronics has stepped up its deployment in the fan-out (FO) wafer-level packaging segment with plans to set up related production lines in Japan, according to industry sources. Samsung has ...

MILPITAS, Calif.--(BUSINESS WIRE)--Nanometrics Incorporated (NASDAQ:NANO), a leading provider of advanced process control metrology and inspection systems, today announced that its SPARK-API macro ...

This study investigates creation of 1.0µm RDL structures by a damascene process utilizing a photosensitive permanent dielectric material. The advantage of the photosensitive dielectric approach is ...

FREMONT, Calif., May 08, 2024 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACMR) (“ACM”) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level ...

FREMONT, Calif., Aug. 25, 2021 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) ...

Selbyville, Delaware, June 26, 2023 (GLOBE NEWSWIRE) -- Fan-Out Wafer Level Packaging Market is set to surpass USD 5 billion by the end of 2032 , as per a recent study by Global Market Insights Inc.

Jordan Valley, a leading supplier of X-ray based in-line metrology systems for advanced semiconductor manufacturers, today announced that it received an order from a market-leading equipment ...

Charlotte, N.C., Feb. 01, 2021 (GLOBE NEWSWIRE) -- Akoustis Technologies, Inc. (NASDAQ: AKTS) (“Akoustis” or the “Company”), an integrated device manufacturer (IDM) of patented bulk acoustic wave (BAW ...

With the industry recovery coming on slowly, cost is a more important factor than ever. Semiconductor manufacturers are constantly under pressure to reduce costs, and during a down cycle they must do ...

Semiconductor manufacturing equipment maker KLA Corporation (NASDAQ:KLAC) reported Q1 CY2026 results , with sales up 11.5% ...