Abstract: 2.5D glass interposer technology based on through glass via (TGV) becomes a hot research topic on account of good electrical property and CTE (coefficient of thermal expansion) mismatch [1].
Professor of Biology and Engineering Duane Juang, who researches proteins that change in a magnetic field, invited the BDI full time staff to test out his UV DPSS Laser. Here we are etching an ultra ...
Abstract: This work presents a new concept for using glass as a component material in FOWLP. Glass exhibits excellent properties for advanced packaging applications, such as low loss tangent, low ...
Customer stories Events & webinars Ebooks & reports Business insights GitHub Skills ...
Customer stories Events & webinars Ebooks & reports Business insights GitHub Skills ...
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